Optical solder inspection from Compar checks the presence of the soldering, the shape and contour of the solder joint, but also detects dents or bridges and ensures defect-free end-user products
Quality requirements for solder joints could not be more different. That's why Compar offers a solder inspection system that can adapt to the quality requirements of the solder joints. 3D scanners, for example, are very suitable when it comes to complex solder joints where the complete profile is to be evaluated. If, on the other hand, solder presence is to be checked, area scan cameras are used. The decisive factor for a robust and reliable quality assessment of solder joints is the available image processing libraries. In addition to the classic algorithms, Compar has also been using deep learning-based algorithms for some time. They act on the basis of taught-in good and bad solder joints and deliver convincing results.
Compar AG has an extensive collection of smart solder joint algorithms, summarised as a solder inspection module, which is a main component of the holistic image processing software VISIONexpert®. Based on the customer's requirements, the appropriate algorithms for the solution are determined, tested and finally implemented.
Defect-free solder joints
Robust testing algorithms detect the presence and amount of solder.
Ease of use
Fast and simple production-accompanying training routines for new products. Short changeover times between different products
Degrees of freedom and flexibility
Solder joints can be inspected with 2D cameras or 3D scanners. Depending on the quality control requirements, "Deep Learning" algorithms are also used in addition to the classic inspection method, which achieve the best results.
